The EFD Solder Paste Group has introduced a colourless no-clean flux for use in its PrintPlus and SolderPlus solder paste product range.
The series leaves a clear residue for a good cosmetic joint finish. In addition, with this flux system, printed or dispensed solder paste deposits retain their shape through the reflow cycle without slumping or bridging, making the flux suitable for fine pitch, no-clean electronic and electro-mechanical soldering. Synthetic resin eliminates the dark amber residue discoloration common with other natural rosin-based fluxes and contributes to good anti-slump characteristics.
The P520 series is available in PrintPlus printing paste and the D540 series is used in SolderPlus dispensing formulations. Both support EFD's full range of lead-free and tin/lead solder paste alloys. This flux is environmentally safe and exceeds the IPC Joint Industry Standards J-STD-004A.
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