congatec COM-HPC and COM Express server-on-modules

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congatec celebrates the premiere for x86 based COM-HPC server modules by announcing the availability of three new server-on-module families parallel to the launch of the Intel Xeon D processor family, formerly codenamed Ice Lake D.

The COM-HPC server modules in size E and size D, as well as the COM Express Type 7 modules, will accelerate real-time microserver workloads in rugged environments and extended temperature ranges. Improvements include up to 20 cores, RAM to up to 1 TB, double throughput per PCIe lanes to Gen 4 speed, as well as up to 100GbE connectivity and TCC/TSN support.

Target applications range from industrial workload consolidation servers for automation, robotics and medical backend imaging to outdoor servers for utilities and critical infrastructures — such as smart grids for oil, gas and electricity as well as rail and communication networks — and also includes vision-enabled applications such as autonomous vehicles and video infrastructures for safety and security.

Besides the bandwidth and performance improvements, congatec’s three new server-on-module families could extend the lifecycle of rugged edge server designs as long-term availability of up to 10 years is planned. For mission-critical designs, they offer hardware security features including Intel Boot Guard, Intel Total Memory Encryption – Multi-Tenant (Intel TME-MT) and Intel Software Guard Extensions (Intel SGX).

AI applications benefit from built-in hardware acceleration including AVX-512 and VNNI. For RAS capabilities, the processor modules integrate the Intel Resource Director Technology (Intel RDT) and support remote hardware management features such as IPMI and redfish.

For further information: https://www.congatec.com/en/technologies/intel-xeon-d-modules/.